Submission declined on 26 May 2026 by .nhals8 (talk). This draft has been re-submitted without any changes made to resolve the reason(s) left by previous reviewer on why the draft was previously declined. For this reason, this draft is declined again for the same reason(s) as that of the previous reviewer. Answering the question made by the submitter in the short description made when submitting this draft, while the topic is notable as an important component in advanced semiconductor manufacturing, please refer to the reasons made by Somepinkdude and Nighfidelity, as the only sources that are attempting to support its inclusion are shopping lists made by technology companies, instead of more in-depth sources (preferably academic/technical) discussing them, such as its history, design, implementation, etc. If you would like to continue working on the submission, click on the "Edit" tab at the top of the window. If you have not resolved the issues listed above, your draft will be declined again and potentially deleted. If you need extra help, please ask us a question at the AfC Help Desk or get live help from experienced editors. Please do not remove reviewer comments or this notice until the submission is accepted. Where to get help If you need help editing or submitting your draft, please ask us a question at the AfC Help Desk or get live help from experienced editors. These venues are only for help with editing and the submission process, not to get reviews. If you need feedback on your draft, or if the review is taking a lot of time, you can try asking for help on the talk page of a relevant WikiProject. Some WikiProjects are more active than others so a speedy reply is not guaranteed. How to improve a draft Wikipedia:Contributing to Wikipedia – a basic overview on how to edit Wikipedia. Help:Wikitext – how to use the markup Help:Referencing for beginners – how to include references Wikipedia:Article development – how to develop your article Wikipedia:Writing better articles – how to improve your article Wikipedia:Verifiability – make sure your article includes reliable third-party sources You can also browse Wikipedia:Featured articles and Wikipedia:Good articles to find examples of Wikipedia's best writing on topics similar to your proposed article. Improving your odds of a speedy review To improve your odds of a faster review, tag your draft with relevant WikiProject tags using the button below. This will let reviewers know a new draft has been submitted in their area of interest. For instance, if you wrote about a female astronomer, you would want to add the Biography, Astronomy, and Women scientists tags. Add tags to your draft Editor resources Easy tools: Citation bot (help) | Advanced: Fix bare URLs Declined by .nhals8 11 days ago. Last edited by .nhals8 11 days ago. Reviewer: Inform author. Resubmit Please note that if the issues are not fixed, the draft will be declined again.

Submission declined on 9 May 2026 by SomeoneDreaming (talk). Uphold previous review. Do not resubmit without making changes. Declined by SomeoneDreaming 28 days ago.

Submission declined on 26 February 2026 by Nighfidelity (talk). This draft's references do not show that the subject meets Wikipedia's criteria for inclusion. The draft requires multiple published secondary sources that: provide significant coverage: discuss the subject in detail, not just brief mentions or routine announcements; are reliable: from reputable outlets with editorial oversight; are independent: not connected to the subject, such as interviews, press releases, the subject's own website, or sponsored content. Please add references that meet all three of these criteria. If none exist, the subject is not yet suitable for Wikipedia. Declined by Nighfidelity 3 months ago.

Submission declined on 11 January 2026 by Somepinkdude (talk). This draft's references do not show that the subject meets Wikipedia's criteria for inclusion. The draft requires multiple published secondary sources that: provide significant coverage: discuss the subject in detail, not just brief mentions or routine announcements; are reliable: from reputable outlets with editorial oversight; are independent: not connected to the subject, such as interviews, press releases, the subject's own website, or sponsored content. Please add references that meet all three of these criteria. If none exist, the subject is not yet suitable for Wikipedia. Declined by Somepinkdude 4 months ago.

Submission declined on 10 January 2026 by Lynch44 (talk). This draft is not adequately supported by reliable sources. Wikipedia's verifiability policy requires that all content be supported by reliable sources. Reliable sources include: reputable newspapers, magazines, academic journals, and books from respected publishers. Unacceptable sources include: personal blogs, social media, predatory publishers, most tabloids, and websites where anyone can contribute. Replace any unreliable sources with high-quality sources. If you cannot find a reliable source for the material, it should be removed. Declined by Lynch44 4 months ago.

• Comment: The topic could be notable, but 6 shopping links (which violate WP:ELNO) don't do anything to show that. Somepinkdude (talk) 13:37, 11 January 2026 (UTC)

• Comment: In accordance with the Wikimedia Foundation's Terms of Use, I disclose that I have been paid by my employer for my contributions to this article. ShimantoEagle (talk) 18:47, 10 January 2026 (UTC)

IC Substrate, also referred as IC Packaging Substrate or Semiconductor Packaging Substrate is a type of component used for interconnect between the semiconductor die and PCB board. It acts as a intermediate interconnect stage between nanoworld features of Silicon die and microworld of Printed Circuit Board.^[1]

IC Substrate is more and more prominent in today's advanced semiconductor world due to ever shrinking size of modern Integrated Circuit chips and due to the rapid development of advanced semiconductor packaging.^[2]

There are different types of IC Substrate used. Most prominent one is the organic IC Substrate used as a cheap interconnect layer between die-to-die and die to PCB.^[3] Ceramic Substrate is also used in sophisticated application such as Defence and Space application where the temperature and environmental side-effect determines the mission critical outcome of the projects. Organic IC Substrates are fast resurfacing as the cost effective de-facto carrier solution for Fan-out Panel Level Packaging (FOPLP) where size of panel determines the manufacturing cost and organic substrates are a viable alternatives to glass core substrate.^[4] Manufacturing of such IC Substrates needs the cumulative technology of front-end semiconductor such as metallization/metal plating, bump interconnect as well as advanced PCB manufacturing process such as laser drilling to create interlayer vias, multiple layers of conductive metal lines.^[5]

A typical IC substrate can be of multiple layers. It serves as the basis of advanced semiconductor packaging and facilitates the necessary interconnect between the different semiconductor dies mounted on top of it.

Top side of the IC Substrate is usually connected with the semiconductor dies with microbumps or Cu pillars and bottom side of the IC Substrate connects with the PCB via ball grid arrays, which are essentially solder bumps. Advanced IC Substrate also has the ability to embed passive components such as thin film chip capacitor, chip resistor or chip inductors inside the structure, thus reducing the interconnect spacing.^[6]

Embedding capability of such passive components inside a substrate leverages the shorter interconnect path which reduces the parasitic capacitance and possible cross-talk, which is specially very cruical for RF chips.

There are handfull of companies manufacturing such substrate. Japanese IBIDEN,^[7] Shinko^[8] is prominent. Among Korean companies, Samsung Electro-Mechanics Samsung_Electro-Mechanics^[9], Daedook Electronics, LG Innolux are prominent. Among Taiwanense companies, Unimicron^[10] is the most famous one. Just like semiconductor front-end fabs, China is also pushing heavily to manufacture such substrate, most notably Shennan Circuits,^[11] although the high-end technologically sophisticated substrates are still produced by Japanese, Korean and Taiwanese companies. Among European companies. AT&S^[12] is the most prominent and advanced one.