TSOP

Thin Small-Outline Package (TSOP) (тонкі малагабарытны корпус) — тып корпусу мікрасхем. Выкарыстоўваецца ў модулях аператыўнай памяці DRAM і для чыпаў флэш-памяці, асабліва для ўпакоўкі нізкавольных мікрасхем з-за іх малога аб'ёма і вялікай колькасці штыркоў (кантактаў). В больш сучасных модулях памяці (DDR2 SDRAM, DDR3 SDRAM) выціснуты кампактнейшымі схемамі тыпу BGA.

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